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| data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. photocoupler ps8501,ps8501l1,ps8501l2,ps8501l3 high speed analog output type 8 mm creepage 8-pin photocoupler ? nepoc series ? document no. pn10656ej04v0ds (4th edition) date published september 2009 ns printed in japan 2007, 2009 the mark data sheet pn10656ej04v0ds 2 ps8501,ps8501l1,ps8501l2,ps8501l3 package dimensions (unit: mm) dip type ps8501 9.25 +0.5 ?0.25 6.5 +0.5 ?0.1 0 to 15 7.62 2.54 1.01 +0.4 ?0.2 0.50.15 0.840.15 0.25 m 3.50.2 4.150.3 2.8 min. lead bending type (gull-wing) for surface mount ps8501l3 6.5 +0.5 ?0.1 9.65 0.4 0.740.25 0.6350.15 2.54 3.50.2 1.01 +0.4 ?0.2 9.25 +0.5 ?0.25 0.50.15 0.25 m data sheet pn10656ej04v0ds 3 ps8501,ps8501l1,ps8501l2,ps8501l3 lead bending type for long creepage distance ps8501l1 9.25 +0.5 ?0.25 6.5 +0.5 ?0.1 0 to 15 10.16 2.54 3.50.2 3.870.4 2.8 min. 1.01 +0.4 ?0.2 0.50.15 0.25 m 0.840.15 lead bending type for long creepage distance (gull-wing) for surface mount ps8501l2 9.25 +0.5 ?0.25 6.5 +0.5 ?0.1 11.8 0.4 2.54 3.50.2 1.01 +0.4 ?0.2 0.90.25 0.250.2 0.50.15 0.25 m data sheet pn10656ej04v0ds 4 ps8501,ps8501l1,ps8501l2,ps8501l3 photocoupler construction parameter ps8501, ps8501l3 ps8501l1, ps8501l2 air distance (min.) 7 mm 8 mm outer creepage distance (min.) 7 mm 8 mm isolation distance (min.) 0.4 mm 0.4 mm marking example 8501 n 931 no. 1 pin mark type number assembly lot year assembled (last 1 digit) 9 31 n rank code in-house code (l or t) week assembled data sheet pn10656ej04v0ds 5 ps8501,ps8501l1,ps8501l2,ps8501l3 ordering information part number order number solder plating specification packing style safety standard approval application part number * 1 ps8501 ps8501-ax pb-free magazine ca se 50 pcs standard products ps8501 ps8501l1 ps8501l1-ax (ni/pd/au) (ul, csa, bsi, ps8501l1 ps8501l2 ps8501l2-ax semko, nemko, ps8501l2 ps8501l3 ps8501l3-ax demko, fimko ps8501l3 ps8501l2-e3 ps8501l2-e3-ax embossed t ape 1 000 pcs/reel approved) ps8501l2 ps8501l3-e3 ps8501l3-e3-ax ps8501l3 ps8501-v ps8501-v-ax magazine case 50 pcs din en60747-5-2 ps8501 ps8501l1-v ps8501l1-v-ax (vde0884 part2) ps8501l1 ps8501l2-v ps8501l2-v-ax appr oved (option) ps8501l2 PS8501L3-V PS8501L3-V-ax ps8501l3 ps8501l2-v-e3 ps8501l2-v-e3-ax embossed tape 1 000 pcs/reel ps8501l2 PS8501L3-V-e3 PS8501L3-V-e3-ax ps8501l3 *1 for the application of the safety st andard, following part number should be used. absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit diode forward current *1 i f 25 ma reverse voltage v r 5 v detector supply voltage v cc 35 v output voltage v o 35 v output current i o 8 ma power dissipation *2 p c 100 mw isolation voltage *3 bv 5 000 vr.m.s. operating ambient temperature t a ? 55 to +100 c storage temperature t stg ? 55 to +125 c *1 reduced to 0.33 ma/ c at t a = 70 c or more. *2 reduced to 2.0 mw/ c at t a = 75 c or more. *3 ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-4 shorted together , 5-8 shorted together. data sheet pn10656ej04v0ds 6 ps8501,ps8501l1,ps8501l2,ps8501l3 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. *1 max. unit diode forward voltage v f i f = 16 ma 1.7 2.2 v reverse current i r v r = 3 v 10 a forward voltage temperature coefficent v f / t a i f = 16 ma ? 2.1 mv/ c terminal capacitance c t v = 0 v, f = 1 mhz 30 pf detector high level output current i oh (1) i f = 0 ma, v cc = v o = 5.5 v 3 500 na high level output current i oh (2) i f = 0 ma, v cc = v o = 35 v 100 a low level output voltage v ol i f = 16 ma, v cc = 4.5 v, i o = 2.4 ma 0.15 0.4 v low level supply current i ccl i f = 16 ma, v o = open, v cc = 35 v 150 a high level supply current i cch i f = 0 ma, v o = open, v cc = 35 v 0.01 1 a dc current gain h fe v o = 5 v, i o = 3 ma 65 coupled current transfer ratio ctr i f = 16 ma, v cc = 4.5 v, v o = 0.4 v 15 % isolation resistance r i-o v i-o = 1 kv dc 10 11 isolation capacitance c i-o v = 0 v, f = 1 mhz 0.7 pf propagation delay time t phl i f = 16 ma, v cc = 5 v, r l = 1.9 k 0.22 0.8 s (h l) *2 propagation delay time t plh i f = 16 ma, v cc = 5 v, r l = 1.9 k 0.35 0.8 s (l h) *2 *1 typical values at t a = 25 c *2 test circuit for propagation delay time 18 27 36 45 i f 51 v cc = 5 v (monitor) v o r l c l = 15 pf 0.1 f input output pulse input i f monitor pw = 100 s duty cycle = 1/10 ( ) 50% 1.5 v 5 v v ol t phl t plh remark c l includes probe and stray wiring capacitance. usage cautions 1. this product is weak for static el ectricity by designed with hi gh-speed integrated circuit so protect against static electricity when handling. 2. by-pass capacitor of more than 0.1 f is used between v cc and gnd near device. al so, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. 3. pins 1, 4 (which is an nc *1 pin) can either be connected directly to the gnd pin on the led side or left open. unconnected pins should not be used as a bypass for signal s or for any other similar purpose because this may degrade the internal noise env ironment of the device. *1 nc: non-connection (no connection) 4. avoid storage at a high te mperature and high humidity. data sheet pn10656ej04v0ds 7 ps8501,ps8501l1,ps8501l2,ps8501l3 typical characteristics (t a = 25 c, unless otherwise specified) ambient temperature t a ( c) maximum forward current i f (ma) maximum forward current vs. ambient temperature 30 20 25 10 15 5 0 25 50 75 100 125 ambient temperature t a ( c) detector power dissipation p c (mw) detector power dissipation vs. ambient temperature 120 80 40 0 25 50 75 100 125 100 60 20 output voltage v o (v) output current i o (ma) output current vs. output voltage forward current i f (ma) current transfer ratio ctr (%) current transfer ratio vs. forward current v cc = 4.5 v, v o = 0.4 v 50 40 30 20 10 0 0.1 0.5 1 5 10 50 100 forward voltage v f (v) forward current i f (ma) forward current vs. forward voltage 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 0.01 0.1 1.0 10 100 t a = +100 c +85 c +50 c +25 c 0 c ?20 c ?40 c ambient temperature t a ( c) normalized current transfer ratio ctr normalized current transfer ratio vs. ambient temperature ?75 ?50 ?25 0 25 50 75 100 125 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 normalized to 1.0 at t a = 25 c, i f = 16 ma, v cc = 4.5 v, v o = 0.4 v 12 10 4 8 6 2 048 1820 16 2 6 10 12 14 i f = 25 ma 20 ma 15 ma 10 ma 5 ma remark the graphs indicate nominal characteristics. data sheet pn10656ej04v0ds 8 ps8501,ps8501l1,ps8501l2,ps8501l3 ambient temperature t a ( c) high level output current i oh (na) high level output current vs. ambient temperature load resistance r l (k ) propagation delay time t phl , t plh ( s) propagation delay time, vs. lord resistance 10 1 0.1 10 100 1 1 000 1 0.1 100 10 50 100 ?25 0 25 75 ambient temperature t a ( c) propagation delay time, vs. ambient temperature propagation delay time t phl , t plh ( s) t phl t plh v cc = 5 v, i f = 16 ma, r l = 1.9 k ?50 ?25 0 25 50 75 100 125 3.0 2.5 2.0 1.5 1.0 0.5 0.0 forward current i f (ma) output voltage v o (v) output voltage vs. forward current 6 7 5 4 2 0 3 1 12 16 20 48 26 10 14 18 v cc = 5 v r l v cc i f 5.5 k r l = 1.9 k 12 k i f = 0 ma v cc = v o = 35 v v cc = v o = 5.5 v v cc = 5 v, i f = 16 ma t plh t phl remark the graphs indicate nominal characteristics. data sheet pn10656ej04v0ds 9 ps8501,ps8501l1,ps8501l2,ps8501l3 taping specifications (unit: mm) 2.050.05 2.00.1 4.00.1 1.750.1 24.00.3 10.70.1 12.00.1 1.5 +0.1 ?0 4.5 max. 12.80.1 4.1 0.1 0.30.05 11.50.1 tape direction ps8501l2-e3 outline and dimensions (tape) outline and dimensions (reel) packing: 1 000 pcs/reel 3302.0 1001.0 2.00.5 13.00.2 r 1.0 21.00.8 2.00.5 23.9 to 27.4 outer edge of flange 25.51.0 29.51.0 data sheet pn10656ej04v0ds 10 ps8501,ps8501l1,ps8501l2,ps8501l3 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 5.3 max. 10.30.1 12.00.1 1.5 +0.1 ?0 7.50.1 10.40.1 16.00.3 4.750.1 0.350.05 outline and dimensions (reel) packing: 1 000 pcs/reel 3302.0 1001.0 2.00.5 13.00.2 r 1.0 21.00.8 2.00.5 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0 tape direction ps8501l3-e3 data sheet pn10656ej04v0ds 11 ps8501,ps8501l1,ps8501l2,ps8501l3 recommended mount pad dimensions (unit: mm) d c b a part number ps8501l2 ps8501l3 lead bending a lead bending type (gull-wing) for long creepage distance (surface mount) lead bending type (gull-wing) for surface mount 10.2 8.2 b 2.54 2.54 c 1.7 1.7 d 2.2 2.2 data sheet pn10656ej04v0ds 12 ps8501,ps8501l1,ps8501l2,ps8501l3 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220 c 180 c package surface temperature t ( c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260 c max. 120 c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron ? peak temperature (l ead part temperature) 350 c or below ? time (each pins) 3 seconds or less ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperatur e of the package woul d not be heated over 100 c. data sheet pn10656ej04v0ds 13 ps8501,ps8501l1,ps8501l2,ps8501l3 (4) cautions ? fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly between the photocoupler ?s input and output or between v cc - emitters at startup, the output side may enter the on st ate, even if the voltage is within the absolute maximum ratings. data sheet pn10656ej04v0ds 14 ps8501,ps8501l1,ps8501l2,ps8501l3 specification of vde marks license document parameter symbol speck unit climatic test class (iec 60068-1/din en 60068-1) 55/100/21 dielectric strength maximum operating isolation voltage test voltage (partial discharge test, pr ocedure a for type test and random test) u pr = 1.5 u iorm , p d < 5 pc u iorm u pr 1 130 1 695 v peak v peak test voltage (partial discharge te st, procedure b fo r all devices) u pr = 1.875 u iorm , p d < 5 pc u pr 2 119 v peak highest permissible overvoltage u tr 8 000 v peak degree of pollution (din en 60664-1 vde0110 part 1) 2 comparative tracking index (iec 60112/din en 60112 (vde 0303 part 11)) cti 175 material group (din en 60664-1 vde0110 part 1) iii a storage temperature range t stg ?55 to +125 c operating temperature range t a ?55 to +100 c isolation resistance, minimum value v io = 500 v dc at t a = 25c v io = 500 v dc at t a max. at least 100c ris min. ris min. 10 12 10 11 safety maximum ratings (maximum permi ssible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) power (output or total power dissipation) isolation resistance v io = 500 v dc at t a = tsi tsi isi psi ris min. 175 400 700 10 9 c ma mw data sheet pn10656ej04v0ds 15 ps8501,ps8501l1,ps8501l2,ps8501l3 the information in this document is current as of september, 2009. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. in addition, nec electronics products are not taken measures to prevent radioactive rays in the product design. when customers use nec electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of nec electronics products. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e0904e (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific": ps8501,ps8501l1,ps8501l2,ps8501l3 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. ? do not burn, destroy, cut, crush, or chemically di ssolve the product. ? do not lick the product or in any way allow it to enter the mouth. to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry. notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics. |
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